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NCP5050
MAXIMUM RATINGS (Note 1)
Rating
Power Supply Voltage (Note 2)
Over Voltage Protection
Human Body Model (HBM) ESD Rating (Note 3)
HCS and FB Pins
Machine Model (MM) ESD Rating (Note 3)
HCS and FB Pins
Digital Input Voltage
Digital Input Current
WDFN 3x3 Package
Power Dissipation @ T A = +85 ° C
Thermal Resistance, Junction ? to ? Case
Thermal Resistance, Junction ? to ? Air
Operating Ambient Temperature Range
Operating Junction Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Moisture Sensitivity Level (Note 7)
Symbol
P Vin
V S
ESD HBM
ESD MM
CTRL, CM
P D
R q JC
R q JA
T A
T J
T JMAX
T stg
MSL
Value
7.0
25
2000
1000
200
150
? 0.3 < V in < V bat + 0.3
1.0
(Note 5)
10
(Note 6)
? 10 to +85
? 10 to +125
+150
? 65 to +150
1
Unit
V
V
V
V
V
mA
W
° C/W
° C
° C
° C
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at T A = 25 ° C.
2. According to JEDEC standard JESD22 ? A108B.
3. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) per JEDEC standard: JESD22 ? A114 for all pins.
Machine Model (MM) per JEDEC standard: JESD22 ? A115 for all pins.
4. Latch up Current Maximum Rating: $ 100 mA per JEDEC standard: JESD78.
5. The thermal shutdown set to 160 ° C (typical) avoids irreversible damage on the device due to power dissipation.
6. For the 10 ? Pin 3x3 WDFN Package, the R q JA is highly dependent on the PCB heat ? sink area. For example, R q JA can be 61 ° C/W for 2 layers
board having 51 mm 2 dissipation area on circuit side and board size ground plane on other side.
7. Per IPC/JEDEC standard: J ? STD ? 020A.
8. The maximum package power dissipation limit must not be exceeded.
P d +
125 * T A
R q JA
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